Save up to 30% of your design cycle time with Xpedition Package Designer
Trade up to Xpedition Package Designer (xPD) today
xPD is designed for the physical design, verification, and modeling of
emerging High Density Advanced Packaging (HDAP) technologies. Read more
below or talk to an expert today to see how you can reduce your design cycle time using xPD.
Why Xpedition Package Designer is the tool to beat
With design solutions for physical design and verification of advanced packages and 2.5
heterogeneous assemblies, xPD outperforms other IC packaging tools. xPD also supports
all substrate types including silicon interposers with industry leading capacity and performance.
Looking for concurrent design and physical IP block reuse? Look no further. xPD has you
covered and can reduce iterations by identifying sign-off errors in real-time and delivering
manufacturing quality/ready results throughout the design process.
KEY BENEFITS FOR SIEMENS IC PACKAGING DESIGN
FLOW TOOLS
System co-optimization balances requirements and resources across multi-domains,
requiring visibility into downstream effects on PPA and cost.
Automatic hatched metal plane creation with real-time editing, manipulation and push-shove
Automated degassing void insertion into metal planes avoiding differential signaling on adjacent layers
Built-in geometry DRC engine that identifies areas for manual degassing hole insertion
Additional Xpedition Package
Designer Resources
Explore more reasons why you need to consider moving to xPD by browsing these
additional resources. Gain insights into a variety of topics from next-generation
design flow support, to verification and signoff with Calibre.
Dynamic mask-ready hatched metal fill
Automatic hatched metal plane creation with real-time editing, manipulation and push-shove
Degassing void control under diff pairs
Outgassing void capabilities to enable the creation, editing, and
reprocessing metal planes avoiding differential
signaling on adjacent layers
Visual guide for manual void degassing void insertion
Use a built-in geometry DRC engine to detect and identify areas where
outgassing voids can be added utilizing
manual void insertion
Graduated multi-pass out gassing
Automated multi-pass graduated degassing void insertion
into metal plane areas across multiple layers
utilizing different size void schemes to create custom voids quickly
Offset hatched planes
Automated plane hatch capabilities to create custom plane offsets quickly and across layers
Predictable PDN stability
Powerful power distribution network (PDN) analysis and screening to locate potential power delivery issues
Additional Xpedition Package
Designer Resources
Explore more reasons why you need to consider moving to Xpedition Package
Designer. From next-generation design flow support to its leading verification
and signoff with Calibre. Learn how to meet manufacturing process requirements and
why STMicroelectronics chose Xpedition Substrate Integrator for the next generation automotive modules..
Methodology To Meet Manufacturing Process Requirements
Discover three methodologies that are commonly used to achieve foundry/OSAT
requirements for metal areas and planes in advanced package designs: dynamic
hatched filled metal areas, outgassing voids, and dummy metal fill
Heterogeneous Chiplet Design and Integration
Learn about 5 workflows to deliver the most impactful effects on successfully implementing and designing
with
chiplets
Using a System Technology Co-Optimization (STCO) Approach for 2.5/3D Heterogeneous Semiconductor
Integration
Examine a power and signal integrity prototyping in STCO HDAP, but with an approach that applies equally
to
thermal, warp, and mechanical stress
See xPD in action
Please complete the form below and one of our technology experts will be in touch shortly.
Cut your design times by 30%
xPD is designed for the physical design, verification, and modeling of emerging High Density
Advanced Packaging (HDAP) technologies. If you would like to learn more we invite you to explore
the overview video, white papers, and how-to videos on this resource page. Check it out!
WHAT CUSTOMERS SAY ABOUT XPD
“With the Siemens’ High-Density Advanced Package (HDAP) tools our customers
are now able to go from CWI to wafer mask ready in a short and highly reliable path.”
Jay Kim
Senior VP, CTO
NEPES Corp
Senior VP, CTO
NEPES Corp
