See xPD in action
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Cut your design times by 30%
xPD is designed for the physical design, verification, and modeling of emerging High Density
Advanced Packaging (HDAP) technologies. If you would like to learn more we invite you to explore
the overview video, white papers, and how-to videos on this resource page. Check it out!
WHAT CUSTOMERS SAY ABOUT XPD
“With the Siemens’ High-Density Advanced Package (HDAP) tools our customers
are now able to go from CWI to wafer mask ready in a short and highly reliable path.”
Jay Kim
Senior VP, CTO
NEPES Corp
Senior VP, CTO
NEPES Corp
